Semi compact size solder wave. Applicable to lead free operations. 2 zones forced air preheating, finger conveyor type, special SMD and standard nozzle. Thanks to this specifications HS03-2000 ensure high soldering quality
Specification
Electrronic Supply
Power
30kw
Voltage
3Φ 380V 50Hz/60Hz
Current
46A(380V)
Domensions
Length x Width x Height
2880 x 1300 x 1570
Weight
1400kg
Heating Zones
Forced Convection System
Hot Air Circulation + IR Heater
Blow Motor System
2 Zone
Heating Method
IR (Infrared Type) Heating, Surrounding Heating
Length
1100mm
Temperature Control
Temperature Repeatability
±0.1°C
Heating Power For One Zone
6kw
Range of Temperature
25 ~ 350°C
Cooling System
Cooling Method
Dual Fan(Air Fan)
Conveyor Feeding System
Width Control
Manual
PCB Size
30 ~ 460mm
Conveyor Speed
0.5 ~ 2.0m/min
Fixing rail
Front Rail Fixing
Rail Slant
2 ~ 5°
Pot Assembly System
Solder Storage
440kg( Lead Free )
Flux Storage
25l
1st Nozzle
4 Row
2nd Nozzle
Auto Fill Back System
Pot Up/Down
Manual
Pot In/Out
Manual
Air Pressure
5kg/cm2
Option
Cooling System
Number of Cooling Zone
Upper 1 / Down 1
Cooling Style
Radiator Cooling
Range of Cooling Temperature
5 ~ 30°C
Length x Width x Height
590 x 490 x 1134
Weight
80kg
Cooling Capacity
4300 kcal/h
Auto PCB-Warp Preventing of Heating Zones
RPM Meter of Impeller Motor
Out Mesh Conveyor
Auto Solder Feede
Flux Gravity Controller
Spray Fluxer
Features
Maximization of heat efficiency by forced air preheating
Adoption of nozzle plate driving system for fill-back adjustment (Patent registered as a new design for practical use)
Reliable Safety - Electric Panel Motor driving with inveter. Heating elements controlled by SSR and PID temperature controlle
Flux Spray or Foaming Flux Foaming or spray curve is adjustable to PCB characteristics
