The VLO 6 vacuum soldering system has been designed for Advanced Packaging and Power Semiconductor applications and achieves very high heating and cooling rates. The system meets the highest demands of Start-ups and R & D departments which use vacuum to achieve void less soldering joints. VLO 6 is the small-size entry level system of centrotherm's VLO-family with a 6 liter chamber volume, yet offering the full functionality like the other VLOs. With the VLO 6, the soldered area affected by voids can be reduced to less than 2 %, typical reflow soldering systems range at 20 %.
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Applications
Advanced Packaging
Hermetic Package Sealing
Hybrid Microelectronics Assemblies
MEMS Package Sealing
Optoelectronic Packaging
Power Semiconductors
UHB LED Packaging
Wafer Level Packaging
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This system is ideal for production facilities and start-ups which run flux less and void less soldering processes with various gas atmospheres (N2, H2 100, N2/H2 95/5). It can also
provide wet chemical activation with HCOOH and dry chemical activation with MW plasma for ultra clean soldering joints.
Even lead free paste or pre-forms can be used without additional flux.
The process control computer comes with a user-friendly touch screen for operating, process profile editing and recipe storing. A serial interface lets you transfer data to PCs for offline programming and remote service monitoring.
