The VLO 20 vacuum soldering system meets the highest demands of R&D departments as well as the needs of small production facilities which use vacuum to achieve void less soldering joints. With the VLO 20, the soldered area affected by voids can be reduced to less than 2 %, typical reflow soldering systems range at 20 %.
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Applications
Hermetic Package Sealing
Hybrid Microelectronics Assemblies
MEMS Package Sealing
Package Sealing
Power Semiconductors
UHB LED Packaging
Wafer Level Packaging
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This system is ideal for production facilities which run flux less and void less soldering processes with various gas atmospheres (N
2, H
2 100, N
2/H
2 95/5). It can also provide wet chemical activation with HCOOH and dry chemical activation with MW or RF plasma for ultra clean soldering joints.
Even lead free paste or pre-forms can be used without additional flux.
The process control computer comes with a user-friendly touch screen for operating, process profile editing and recipe storing. A serial interface lets you transfer data to PCs for offline programming and remote service monitoring.
