In cazul unei lipiri cu un cuptor normal reflow, lipirile contin 20-30% goluri, fapt nepermis in multe din cazuri, astfel fiind necesara folosirea cuptorului cu vacuum, unde procesul de reflow produce vacumarea totala pentru o perioada de timp definit, apoi in functie de proces camera este umpluta cu un gaz pentru activare. Astfel gaurile din lipire vor fi mai putin de 2%.

Un alt avantaj este posibilitatea lipirii fara a utiliza flux, obtinand astfel o lipire extrem de curata.

Nu in ultimul rand spatiul in care se efectueaza lipirea este un spatiu deosebit de curat, neexistand posibilitatea ca sa patrunda orice fel de impuritate.

In unele domenii, lipirea in vacum este indispensabila: electronica de putere microelectronica hibrida optoelectronica invelire ermetica comp. UHB LED comp. MEMS

This system is ideal for production facilities and start-ups which run flux less and void less soldering processes with various gas atmospheres (N₂, H₂ 100, N₂/H₂ 95/5). It can also
provide wet chemical activation with HCOOH and dry chemical activation with MW plasma for ultra clean soldering joints.

Even lead free paste or pre-forms can be used without additional flux.

The process control computer comes with a user-friendly touch screen for operating, process profile editing and recipe storing. A serial interface lets you transfer data to PCs for offline programming and remote service monitoring.