The vacuum soldering systems VLO 180 and VLO 300 are ideal for high volume production facilities with various materials at up to 650 °C. They are equipped with integrated heating and cooling plates, which can be individually controlled. With the VLO 180 or VLO 300, the soldered area affected by voids can be reduced to less than 2 %, typical reflow soldering systems range at 20 %.

Applications Hermetic Package Sealing Hybrid Microelectronics Assemblies MEMS Package Sealing Optoelectronic Packaging Power Semiconductors UHB LED Packaging Wafer Level Packaging

This system is ideal for production facilities which run flux less and void less soldering processes with various gas atmospheres N₂, H₂ up to 100 %, N₂/H₂ 95/5 %). It can also provide wet chemical activation with HCOOH and dry chemical activation with MW plasma for ultra clean soldering joints.

Even lead free paste or pre-forms can be used without additional flux.

The process control computer comes with a user-friendly touch screen for operating, process profile editing and recipe storing. A serial interface lets you transfer data to PCs for offline programming and remote service monitoring.