'Anti-cracking properties' stop cracking caused by repeated heating and cooling of electronic components. Although lead-free solder has a higher melting point than eutectic solder, the crack occurrence rate is low, the "rate of creep" is slower and wettability is better, making more reliable solder joints.
GENERAL USE SOLDER
|
Model
|
Item
|
M.T.
|
Diameter
|
Sn
|
Length
|
|
SD-101
|
Rosin core solder lead
|
183-215°C
|
φ1.2mm
|
50%
|
Approx. 0.8m
|
Solder bar/Line solder (without rosin)
|
Model
|
Item
|
Sn
|
M.T.
|
Width
|
Thickness
|
Length
|
Weight
|
pieces per pack
|
| SD-15 |
Solder bar
(no rosin)
|
50%
|
183-215°C
|
13mm
|
3mm
|
320mm
|
Approx. 115g
|
1
|
| SD-K15 |
183-215°C
|
Approx. 1kg
|
10
|
| SD-16 |
60%
|
183-190°C
|
Approx. 110g
|
1
|
| SD-K16 |
183-190°C
|
Approx. 1kg
|
10
|
| SD-25 |
Line solder
(no rosin)
|
50%
|
183-215°C
|
3mm
|
320mm
|
Approx. 20g
|
4
|
| SD-K25 |
183-215°C
|
Approx. 1kg
|
50
|
| SD-26 |
60%
|
183-190°C
|
Approx. 19g
|
4
|
| SD-K26 |
183-190°C
|
Approx. 1kg
|
50
|
Lead-free line solder (without rosin) Reccomended for stained glass
|
Model
|
Item
|
M.T.
|
Diameter
|
Composition
|
Length
|
Weight
|
pieces per pack
|
|
SD-K20
|
Line solder
|
229°C
|
φ3mm
|
Sn99.25
Cu0.75
|
320mm
|
Approx. 1kg
|
60
|
Electronics solder (with rosin core)
|
Model
|
Item
|
M.T.
|
Diameter
|
Sn
|
Length
|
|
SD-215
|
Electrical use solder
|
183-215°C
|
φ1.2mm
|
50%
|
Approx. 2.2m
|
