For The Removal and Replacement of BGA, CSP, LGA, QFP, PLCC and other Components.

Ideal for Lead-Free

FOR STABLE AND SAFE REWORK
· Auto-Profiling · Various Automated Functions
· Powerful Heating System · PC Controlled
· Max 420 X 400mm Board, Min 2mm x 2mm

RD-500S Specifications

-Handles Boards up 400mm x 420mm
-Handles comonents from 2mm - 50mm
-Auto-Profiling Software
-Multi Stage hot air heaters (Top and Bottom)
-Placement accuracy +/-25µm
-High resolution digital Split-Imaging Vision System
-Use Standard (Air) or Nitrogen gas
-Process / Data logging

The RD-500 was designed with high power top and bottom hot air heaters for local heating of the component and board during rework. It also has an optional IR area heaters on the bottom to prevent warpage of the Printed Circuit Board during the rework process. This highly efficient heating system is especially useful when reworking BGAs, CSPs, and other area array components that need to be attached with Lead-Free solder. The heating system is computer controlled for accuracy and the heat profile is created automatically via built-in Auto-profiling software.
The component is picked up with a single click of the mouse button and is then held inside the nozzle during placement. This eliminates any of the troublesome handling of the component during rework. The alignment is then competed by viewing the board and the component array simultaneously with a prism image picked up by a CCD camera. This image is then fed into the computer via a high-resolution video capture card. The picture is then viewed on the built-in video monitor. For large components the screen can also be split in order to make the viewing and placement easier.
The component is then placed automatically with a single force setting of between 70-100 grams. This is achieved with a friction fitting that is overcome by the downward placement of the component on the board. This ensures that the component is placed with enough force to overcome the surface tension of the flux or paste, but is low enough to that is prevents damage to thinner more delicate components. The board holder can hold a maximum board size of 400mm X 420mm ideal for network, server, and other large boards. The board holder can also be easily adjusted to hold even smaller boards like mobile phones, memory cards, etc. When smaller boards are used, any or all of the IR area heaters can be shut off in order to save energy.
The heat profile is controlled through five zones with independent adjustment capability for all three heaters. This gives additional flexibility when creating, modifying or updating any profile. The software program and profile information is stored in a Windows ME or XP¦ version computer making it readily accessible. All these features are combined to make the RD-500 one of the most simple, efficient, and price competitive Area Array Rework systems on the market today.