HP-580 hot plate is a perfect solution for BGA and µBGA reballing when appropriate stencil and solder balls are chosen Aluminium hot plate assures perfect heat conduction to preheated PCB Automatic process control and error messages  Accurate, digital control and temperature measurement  Three digits display  Steady temperature distribution  Overheat protectiong Application BGA reballing  PCB preheating before assembling/disassembling Solder removal SMD/BGA rework Technical data Input voltage: 230 V AC  Input power: 1150 W  Temperature range: 50 - 360°C  Dimensions: 200 x 146 x 200 mm Weight: 4,75 kg