Used for a variety of heating applications which include preheat, rework, reflow and curing of printed circuit board assemblies.

Model GF-DL is the same as GF-SL , but with two independent temperature controls and dual 13˜ x 6.4˜ plates.

- Large 13˜ x 13˜ heating area
- HT model option: temperatures up to 600° F*
- 3/4˜ thick aluminum heat plates for precise, even
- heating
- Programmable digital temperature controller precisely
- and automatically regulates temperatures
- Model GF-DL is the same as GF-SL above but with two
- independent temperature controls and dual 13˜ x 6.4˜
- plates.
- CE complian

Dual Function Batch Oven or Hot Plate For Preheat, Rework, Curing & Reflow LEAD FREE* (model-HT for RoHS compliant soldering)

The Gold-Flow™ GF-C oven is ideal for batch SMT reflow, curing and hot plate applications. With its heavy duty construction and stainless steel chamber, the oven is designed for many years of reliable service. Model GF-C conduction/convection oven has a unique dual function as a hot plate or as a forced air convection oven. APS ovens and hot plates are CE compliant.

The most versatile system for preheating, curing, reflowing, rework or thermal cycling.

 

*HT model for use with lead free solder alloys